Every time I cover the vast technological gulf between China’s semiconductor ambitions and their actual native technological knowledge, some commenter blithely states that it’s easy for China to reverse engineer all Western semiconductor technology, which is why they’re already successfully producing chips at the [insert latest CCP propaganda here]nm node, etc. In this they’re engaged in the time-honored rhetorical device known as “talking out their ass.”
Semiconductors are hard. Not only do you have to exactly machine the thousands of painstakingly precise parts in the equipment itself, you need to possess the deep institutional knowledge necessary necessary to tweak the thousands of differing process parameters for different types of chips. Steppers, the lithography machines that actually project the patterns necessary to make each layer of the chip, are at the very top of the mountain in terms of technological complexity, and ASML dominates the stepper market. If it was easy to build steppers, Applied Materials, LAM, or Tokyo Electron would have come out with their own steppers long ago, and they haven’t.
But China would love to get their hands on that technology, which is why they tried to disassemble and backward engineering an ASML DUV stepper and ended up ruining it in the process.
A Chinese firm reportedly has sought technical support from ASML, the world’s largest chipmaking equipment supplier, after it failed to reassemble a deep-ultraviolet (DUV) lithography machine following an internal teardown for alleged reverse engineering.
Note that a DUV stepper is not ASML’s top of the line model. Their Extreme Ultraviolet (EUV) NXE and EXE steppers are far more complex and selling them to China is embargoed.
“An ASML DUV machine that China has used to make their chips recently broke down. They called the Dutch company for help repairing it,” Brandon Weichert, a senior national security editor at The National Interest, says in a X post. “ASML sent some techs. They discovered that the Chinese broke the machine when they disassembled it and tried to put it back together.”
“The reason Chinese technicians took apart their older ASML DUV system is simple. They are trying to find a way around US sanctions on the newest machines,” Weichert says. “By taking apart the older model and attempting to rebuild it, they hope to learn how to produce their own advanced versions. But it seems they still can’t figure it out.”
Weichert says he was unsure whether ASML had repaired the system. He adds that, in his view, although China maintains service agreements with the Dutch company, ASML would be unlikely to honor them given what he characterized as apparent foul play by the customer.
The fact that they couldn’t get the machine back together correctly rather belies the idea that China has world-class semiconductor technical knowledge.
Some Chinese commentators have noted that reverse-engineering ASML’s immersion DUV lithography machines is an exceptionally complex challenge.
A Guangdong-based columnist writing under the pen name “Chengwa” highlighted four key difficulties:
Extreme precision: DUV systems use 193-nm argon fluoride (ArF) lasers and a thin water layer beneath the lens. Even the tiniest misalignment can cause a chain reaction of system errors. Complex mechanics: Inside modern DUV immersion tools, twin wafer stages move rapidly under the lens with sub-nanometer accuracy and process around 330 wafers per hour. Removing one stage without factory calibration can destroy the delicate alignment that field engineers cannot easily restore. Highly integrated technology: ASML’s equipment depends on intricate optical systems, motion platforms and control software perfected in Europe over decades. Replicating all these technologies from scratch is extraordinarily difficult. Precision calibration: The system’s accuracy depends on closed-loop calibration linking optics, sensors and motion control. Dismantling the tool can lead to particle contamination, interferometer drift and loss of key reference points. These problems require vendor-level software keys and procedures to correct.
Like I noted, down below 10nm, everything is exceptionally hard.
After the US banned sales of ASML’s extreme ultraviolet (EUV) lithography machines to China in 2019, Beijing began pouring substantial investment into homegrown lithography development. However, much of that funding has been marred by inefficiency and corruption scandals, limiting technological progress.
Snip.
Last month, the Financial Times reported that China’s leading chipmaker, Semiconductor Manufacturing International Corporation (SMIC), was testing a DUV immersion lithography machine made by Yuliangsheng.
The machine is understood to be an immersion DUV scanner targeting 28-nm chip production, roughly matching the performance of ASML’s Twinscan designs in 2008. Yuliangsheng planned to deploy it on production lines by 2027.
China using their IP-stealing and backward engineering skills to finally replicate a 19-year old design sounds about right…
